The RIEGL VZ-400i is a cutting-edge 3D Laser Scanning System which combines a future-oriented, innovative new processing architecture and internet connectivity with RIEGL’s latest waveform processing LiDAR technology.

 

This real-time data flow is enabled through dual processing platforms: a dedicated processing system for simultaneous acquisition of scan data and image data, waveform processing and system operations, and a second processing platform which enables automatic on-board registration, geo-referencing, and analysis to be executed in parallel. The VZ-400i provides an integrated 3G/4G LTE modem, Wi-Fi, and Ethernet communications hardware.

With its integrated orientation sensor (MEMS IMU, compass, and barometer) the VZ-400i’s up to 1200 kHz pulse repetition rate can be fully utilized in many environments and orientations. The system provides a high range of flexibility by supporting numerous external peripherals and accessories via its integrated USB ports and stable mounting points.

Specifications

Main Features Main Applications

-High laser pulse repetition rate of up to 1.2 MHz

 -Building Infrastructure Management (BIM)

-Integrated GNSS receiver

-Architecture & Facade Measurements

-Eye safe operation at Laser Class 1

-Archaeology & Cultural Heritage

-Wide field of view, 100°x360°

-As-Built Surveying
-Range up to 800 m, accuracy 5 mm

-Forensics & Crash Scene Investigation

-Optional waveform data output

-City Modeling

-Multiple target capability

-Tunnel Surveying

-Automatic on-board registration

-Civil Engineering

-User-developed apps via python software

-Forestry

-Orientation sensor for pose estimation

-Monitoring
-Cloud connectivity via Wi-Fi and 3G/4G LTE -Research

-Compatible with the RIEGL VMZ Hybrid Mobile Laser Mapping System
-Innovative processing architecture for data acquisition and simultaneous geo-referencing in real-time
-NEW simultaneous image and scan data acquisition
-High accuracy and high precision ranging based on echo digitization, online waveform processing, and multiple-time-around processing

-High speed data acquisition up to 500,000 measurements/sec